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Lead-free Solder bar

Solder bar Sn99Ag0.3Cu0.7

Product parameters

☆ good fluidity and wettability< br> ☆ excellent antioxidant, less tin slag< br> ☆ appropriate additives to change the crystalline junction of solder joint Structure, reduce internal stress and resist whisker growth< br> ☆ excellent welding performance, few pull points and bridging;

Scope of application

This product is applicable to the tin spraying operation system on the surface of PCB, and is widely applicable to the wave soldering operation of automatic lead-free soldering furnace.

Specification Download Online consultation

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Solder bar Sn99Ag0.3Cu0.7

Product parameters

Scope of application